RUNTO International Semiconductor Technology Co., Ltd

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Rundao Technology Co., Ltd. was established in 2025 with a registered capital of 12.5 billion Vietnamese dong (approximately 500000 US dollars) and a production plant area of 2720 square meters. Business scope: Focusing on providing professional precision die-cutting production and services for brand terminal manufacturers in the 3C product (Computer, Communication, Consumer Electronics) field; The technical process includes CCD detection, laser, slitting, slitting, cutting, bonding, nesting, die-cutting, hot pressing, and full inspection.

RUNTO International Semiconductor Technology Co., Ltd

2025

Company Established

50

Registered capital (USD 10000)

2720

Floor Area (㎡)

February 2025

Obtained the management of industrial parks in Beining Province Investment registration certificate issued by the bureau

Q1 2025

Decoration of factories and offices Installation of mechanical equipment

Q2 2025

The company officially operates

Development History

Enterprise Honor

Patents: 6 invention patents, 11 utility model patents, 8 software copyrights, a total of 25 patents

Corporate Vision

To become a leading technology company in the industry and a trusted enterprise by customers

Business philosophy

Integrity management, continuous innovation, and green production

Corporate Mission

Create value for customers, generate profits for the enterprise, and create benefits for employees